Datasheet

DocID025644 Rev 3 129/135
STM32F401xD STM32F401xE Package characteristics
133
Figure 59. Recommended PCB design rules for pads (0.5 mm-pitch BGA)
1. Non solder mask defined (NSMD) pads are recommended.
2. 4 to 6 mils solder paste screen printing process.
ddd - - 0.100 - - 0.0039
eee - - 0.150 - - 0.0059
fff - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 84. UFBGA100, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package
mechanical data (continued)
Symbol
millimeters inches
(1)
Min. Typ. Max. Min. Typ. Max.
Pitch
0.5 mm
D pad 0.27 mm
Dsm
0.35 mm typ (depends on
the soldermask registration
tolerance)
Solder paste
0.27 mm aperture diameter
Dpad
Dsm
ai15495
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