Datasheet

Electrical characteristics STM32F401xB STM32F401xC
74/139 DS9716 Rev 11
6.3.7 Wakeup time from low-power modes
The wakeup times given in Table 34 are measured starting from the wakeup event trigger up
to the first instruction executed by the CPU:
• For Stop or Sleep modes: the wakeup event is WFE.
• WKUP (PA0) pin is used to wakeup from Standby, Stop and Sleep modes.
All timings are derived from tests performed under ambient temperature and V
DD
=3.3 V.
APB2
(up to 84 MHz)
TIM1 5.71
µA/MHz
TIM9 2.86
TIM10 1.79
TIM11 2.02
ADC1
(2)
2.98
SPI1 1.19
USART1 3.10
USART6 2.86
SDIO 5.95
SPI4 1.31
SYSCFG 0.71
1. I2SMOD bit set in SPI_I2SCFGR register, and then the I2SE bit set to enable I2S peripheral.
2. When the ADC is ON (ADON bit set in the ADC_CR2 register), add an additional power consumption of 1.6
mA for the analog part.
Table 33. Peripheral current consumption (continued)
Peripheral I
DD
(typ) Unit
Table 34. Low-power mode wakeup timings
(1)
Symbol Parameter Min
(1)
Typ
(1)
Max
(1)
Unit
t
WUSLEEP
(2)
Wakeup from Sleep mode - 4 6
CPU
clock
cycle
t
WUSTOP
(2)
Wakeup from Stop mode, usage of main regulator - 13.5 14.5
µs
Wakeup from Stop mode, usage of main regulator, Flash
memory in Deep power down mode
-105111
Wakeup from Stop mode, regulator in low power mode - 21 33
Wakeup from Stop mode, regulator in low power mode,
Flash memory in Deep power down mode
-113130
t
WUSTDBY
(2)(3)
Wakeup from Standby mode - 314 407 µs
1. Guaranteed by characterization.
2. The wakeup times are measured from the wakeup event to the point in which the application code reads the first instruction.
3. t
WUSTDBY
maximum value is given at –40 °C.
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