Datasheet

DS9716 Rev 11 63/139
STM32F401xB STM32F401xC Electrical characteristics
113
6.3.6 Supply current characteristics
The current consumption is a function of several parameters and factors such as the
operating voltage, ambient temperature, I/O pin loading, device software configuration,
operating frequencies, I/O pin switching rate, program location in memory and executed
binary code.
The current consumption is measured as described in Figure 19: Current consumption
measurement scheme.
All the run-mode current consumption measurements given in this section are performed
with a reduced code that gives a consumption equivalent to CoreMark
code.
V
PDRhyst
(2)
PDR hysteresis - - 40 - mV
V
BOR1
Brownout level 1
threshold
Falling edge 2.13 2.19 2.24
V
Rising edge 2.23 2.29 2.33
V
BOR2
Brownout level 2
threshold
Falling edge 2.44 2.50 2.56
Rising edge 2.53 2.59 2.63
V
BOR3
Brownout level 3
threshold
Falling edge 2.75 2.83 2.88
Rising edge 2.85 2.92 2.97
V
BORhyst
(2)
BOR hysteresis - - 100 - mV
T
RSTTEMPO
(2)(3)
POR reset timing - 0.5 1.5 3.0 ms
I
RUSH
(2)
InRush current on
voltage regulator power-
on (POR or wakeup from
Standby)
- - 160 200 mA
E
RUSH
(2)
InRush energy on
voltage regulator power-
on (POR or wakeup from
Standby)
V
DD
= 1.7 V, T
A
= 125 °C,
I
RUSH
= 171 mA for 31 µs
--5.4µC
1. The product behavior is guaranteed by design down to the minimum V
POR/PDR
value.
2. Guaranteed by design.
3. The reset timing is measured from the power-on (POR reset or wakeup from V
BAT
) to the instant when first
instruction is fetched by the user application code.
Table 19. Embedded reset and power control block characteristics (continued)
Symbol Parameter Conditions Min Typ
Max Unit
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