Datasheet

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STM32F334x4 STM32F334x6 STM32F334x8 Electrical characteristics
101
Figure 30. Typical connection diagram using the ADC
1. Refer to Table 64 for the values of R
AIN
.
2. C
parasitic
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
pad capacitance (roughly 7
pF). A high C
parasitic
value downgrades conversion accuracy. To remedy this,
f
ADC
must be reduced.
General PCB design guidelines
Power supply decoupling must be performed as shown in Figure 11: Power-supply scheme.
The 10 nF capacitor must be ceramic (good quality) and it must be placed as close as
possible to the chip.
6.3.20 DAC electrical specifications
12-bit
converter
Sample and hold ADC
converter
R
AIN
(1)
AINx
V
AIN
Cparasitic
VDD
VT
0.6 V
V
T
0.6 V
I
L ± 1 μA
R
ADC
CADC
MS19881V3
Table 69. DAC characteristics
Symbol Parameter Conditions Min. Typ. Max. Unit
V
DDA
Analog supply voltage - 2.4 - 3.6 V
R
LOAD
(1)
Resistive load
DAC output buffer ON (to V
SSA
)5
-kΩ
DAC output buffer ON (to V
DDA
)25
R
O
(1)
Output impedance DAC output buffer OFF - - 15 kΩ
C
LOAD
(1)
Capacitive load DAC output buffer ON - - 50 pF
V
DAC_OUT
(
1)
Voltage on DAC_OUT
output
Corresponds to 12-bit input code
(0x0E0) to (0xF1C) at V
DDA
= 3.6 V
and (0x155) and (0xEAB) at V
DDA
=
2.4 V
0.2 - V
DDA
– 0.2 V
DAC output buffer OFF
-0.5 - mV
--V
DDA
– 1LSB V
I
DDA
(3)
DAC DC current
consumption in quiescent
mode
(2)
With no load, middle code (0x800)
on the input
- - 380 µA
With no load, worst code (0xF1C) on
the input.
- - 480 µA
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