Datasheet

DocID025083 Rev 7 73/121
STM32F303x6/x8 Electrical characteristics
101
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations
The software flowchart must include the management of runaway conditions such as:
• Corrupted program counter
• Unexpected reset
• Critical Data corruption (for example control registers)
Prequalification trials
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the NRST pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behavior is detected, the software can be hardened
to prevent unrecoverable errors occurring (see the “Software techniques for improving
microcontrollers EMC performance” application note (AN1015)).
Electromagnetic Interference (EMI)
The electromagnetic field emitted by the device are monitored, while a simple application is
executed (toggling 2 LEDs through the I/O ports). This emission test is compliant with the
IEC
61967-2 standard that specifies the test board and the pin loading.
Table 47. EMS characteristics
Symbol Parameter Conditions
Level/
Class
V
FESD
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
V
DD
= 3.3 V, LQFP100, T
A
=
+25°C,
f
HCLK
= 72 MHz
conforms to IEC 61000-4-2
2B
V
EFTB
Fast transient voltage burst limits to be
applied through 100 pF on V
DD
and V
SS
pins to induce a functional disturbance
V
DD
= 3.3 V, LQFP100, T
A
=
+25°C,
f
HCLK
= 72 MHz
conforms to IEC 61000-4-4
4A
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