Datasheet

Electrical characteristics STM32F303x6/x8
50/121 DocID025083 Rev 7
6.3 Operating conditions
6.3.1 General operating conditions
Table 20. General operating conditions
Symbol Parameter Conditions Min. Max. Unit
f
HCLK
Internal AHB clock frequency - 0 72
MHzf
PCLK1
Internal APB1 clock frequency - 0 36
f
PCLK2
Internal APB2 clock frequency - 0 72
V
DD
Standard operating voltage - 2 3.6
V
V
DDA
Analog operating voltage
(OPAMP and DAC not used)
Must have a potential equal to
or higher than V
DD
23.6
Analog operating voltage
(OPAMP and DAC used)
2.4 3.6
V
BAT
Backup operating voltage - 1.65 3.6 V
V
IN
I/O input voltage
TC I/O –0.3 V
DD
+0.3
V
TT I/O -0.3 3.6
TTa I/O –0.3 V
DDA
+0.3
FT and FTf I/O
(1)
–0.3 5.5
BOOT0 0 5.5
PD
Power dissipation at T
A
= 85 °C for
suffix 6 or T
A
= 105 °C for suffix
7
(2)
LQFP64 - 444 mW
PD
Power dissipation at T
A
= 85 °C for
suffix 6 or T
A
= 105 °C for suffix
7
(3)
LQFP48 - 364 mW
T
A
Ambient temperature for 6 suffix
version
Maximum power dissipation –40 85
°C
Low power dissipation
(4)
–40 105
Ambient temperature for 7 suffix
version
Maximum power dissipation –40 105
°C
Low power dissipation
(4)
–40 125
T
J Junction temperature range
6 suffix version –40 105
°C
7 suffix version –40 125
1. To sustain a voltage higher than V
DD
+0.3 V, the internal pull-up/pull-down resistors must be disabled.
2. If T
A
is lower, higher P
D
values are allowed as long as T
J
does not exceed T
Jmax
(see Section 7.6: Thermal characteristics).
3. If T
A
is lower, higher P
D
values are allowed as long as T
J
does not exceed T
Jmax
(see Section 7.6: Thermal characteristics).
4. In low power dissipation state, T
A
can be extended to this range as long as T
J
does not exceed T
Jmax
(see Section 7.6:
Thermal characteristics).
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