Datasheet

ManualsBrandsST ManualsEmbedded Processors & ControllersMicrocontroller 32bit 128KB LQFP
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Package information STM32F303x6/x8
114/121 DocID025083 Rev 7
Table 76. WLCSP - 49 ball, 3.89x3.74 mm, 0.5 mm pitch, wafer level chip scale,
recommended PCB design rules 
Dimension Recommended values
Pitch 0.5 mm
Dpad 0.290 mm
Dsm
0.350 mm typ. (depends on the soldermask 
registration tolerance)
Stencil opening 0.310 mm
Stencil thickness 0.100 mm
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