Datasheet

DS9118 Rev 14 137/149
STM32F303xB STM32F303xC Package information
142
Figure 49. WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale
package recommended footprint
Table 85. WLCSP100 recommended PCB design rules (0.4 mm pitch)
Dimension Recommended values
Pitch 0.4 mm
Dpad 0.225 mm
Dsm 0.290 mm
Stencil thickness 0.1 mm
WLCSP100L_A01Q_FP_V1
Dpad
Dsm
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