Datasheet

DS9118 Rev 14 9/149
STM32F303xB STM32F303xC List of figures
9
package outline. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135
Figure 49. WLCSP100 – 100L, 4.166 x 4.628 mm 0.4 mm pitch wafer level chip scale
package recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
Figure 50. WLCSP100, 0.4 mm pitch wafer level chip scale package
top view example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.Downloaded from Arrow.com.