Datasheet

DocID15274 Rev 10 83/108
STM32F105xx, STM32F107xx Package information
107
Figure 41. LFBGA100 – 100-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package recommended footprint
Figure 40. LFBGA100 – 100-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package mechanical data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min Typ Max Typ Min Max
A - - 1.700 - - 0.0669
A1 0.270 - - 0.0106 - -
A2 - 0.300 - - 0.0118 -
A4 - - 0.800 - - 0.0315
b 0.450 0.500 0.550 0.0177 0.0197 0.0217
D 9.850 10.000 10.150 0.3878 0.3937 0.3996
D1 - 7.200 - - 0.2835 -
E 9.850 10.000 10.150 0.3878 0.3937 0.3996
E1 - 7.200 - - 0.2835 -
e - 0.800 - - 0.0315 -
F - 1.400 - - 0.0551 -
ddd - - 0.120 - - 0.0047
eee - - 0.150 - - 0.0059
fff - - 0.080 - - 0.0031
Table 58. LFBGA100 recommended PCB design rules (0.8 mm pitch BGA)
Dimension Recommended values
Pitch 0.8
Dpad 0.500 mm
Dsm
0.570 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening 0.500 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.120 mm
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