Datasheet

DocID15274 Rev 10 105/108
STM32F105xx, STM32F107xx Revision history
107
14-Sep-2009 4
Document status promoted from Preliminary data to full datasheet.
Number of DACs corrected in Table 3: STM32F105xx and
STM32F107xx family versus STM32F103xx family.
Note 5 added in Table 5: Pin definitions.
V
RERINT
and T
Coeff
added to Table 12: Embedded internal reference
voltage.
Values added to Table 13: Maximum current consumption in Run
mode, code with data processing running from Flash, Table 14:
Maximum current consumption in Run mode, code with data
processing running from RAM and Table 15: Maximum current
consumption in Sleep mode, code running from Flash or RAM.
Typical I
DD_VBAT
value added in Table 16: Typical and maximum
current consumptions in Stop and Standby modes.
Figure 10: Typical current consumption on VBAT with RTC on vs.
temperature at different VBAT values added.
Values modified in Table 17: Typical current consumption in Run
mode, code with data processing running from Flash and Table 18:
Typical current consumption in Sleep mode, code running from Flash
or RAM.
f
HSE_ext
min modified in Table 20: High-speed external user clock
characteristics.
C
L1
and C
L2
replaced by C in Table 22: HSE 3-25 MHz oscillator
characteristics and Table 23: LSE oscillator characteristics (fLSE =
32.768 kHz), notes modified and moved below the tables. Note 1
modified below Figure 16: Typical application with an 8 MHz crystal.
Conditions removed from Table 26: Low-power mode wakeup
timings.
Standards modified in Section 5.3.10: EMC characteristics on
page 54, conditions modified in Table 31: EMS characteristics.
Jitter maximum values added to Table 27: PLL characteristics and
Table 28: PLL2 and PLL3 characteristics.
R
PU
and R
PD
modified in Table 36: I/O static characteristics.
Condition added for V
NF(NRST)
parameter in Table 39: NRST pin
characteristics. Note removed and R
PD
, R
PU
values added in
Table 46: USB OTG FS DC electrical characteristics.
Table 48: Ethernet DC electrical characteristics added.
Parameter values added to Table 49: Dynamic characteristics:
Ethernet MAC signals for SMI, Table 50: Dynamic characteristics:
Ethernet MAC signals for RMII and Table 51: Dynamic
characteristics: Ethernet MAC signals for MII.
C
ADC
and R
AIN
parameters modified in Table 52: ADC
characteristics. R
AIN
max values modified in Table 53: RAIN max for
fADC = 14 MHz.
Table 56: DAC characteristics modified. Figure 38: 12-bit buffered
/non-buffered DAC added.
Table 64: Applicative current consumption in Run mode, code with
data processing running from Flash added.
Small text changes.
Table 65. Document revision history (continued)
Date Revision Changes
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