Datasheet

List of figures STM32F103xF, STM32F103xG
8/136 DocID16554 Rev 4
Figure 41. Standard I/O input characteristics - TTL port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Figure 42. 5 V tolerant I/O input characteristics - CMOS port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Figure 43. 5 V tolerant I/O input characteristics - TTL port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Figure 44. I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Figure 45. Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97
Figure 46. I
2
C bus AC waveforms and measurement circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Figure 47. SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Figure 48. SPI timing diagram - slave mode and CPHA = 1
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Figure 49. SPI timing diagram - master mode
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
Figure 50. I
2
S slave timing diagram (Philips protocol)
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Figure 51. I
2
S master timing diagram (Philips protocol)
(1)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
Figure 52. SDIO high-speed mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Figure 53. SD default mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
Figure 54. USB timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . 107
Figure 55. ADC accuracy characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
Figure 56. Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
Figure 57. Power supply and reference decoupling (V
REF+
not connected to V
DDA
). . . . . . . . . . . . . 111
Figure 58. Power supply and reference decoupling (V
REF+
connected to V
DDA
). . . . . . . . . . . . . . . . 112
Figure 59. 12-bit buffered /non-buffered DAC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Figure 60. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Figure 61. LFBGA144 marking example (package top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
Figure 62. LQFP144 - 144-pin, 20 x 20 mm low-profile quad flat package outline . . . . . . . . . . . . . . 119
Figure 63. LQFP144 - 144-pin,20 x 20 mm low-profile quad flat package
recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
Figure 64. LQFP144 marking example (package top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
Figure 65. LFP100 – 14 x 14 mm 100 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . 123
Figure 66. LQFP100 recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 124
Figure 67. LQFP100 marking example (package top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
Figure 68. LFP64 – 10 x 10 mm 64 pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 126
Figure 69. LQFP64 - 64-pin, 10 x 10 mm low-profile quad flat recommended footprint . . . . . . . . . . 127
Figure 70. LQFP64 marking example (package top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
Figure 71. LQFP100 P
D
max vs. T
A
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131
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