Datasheet

Package information STM32F103xC, STM32F103xD, STM32F103xE
122/143 DS5792 Rev 13
6.4 LQFP144 package information
Figure 70. LQFP144 - 144-pin, 20 x 20 mm low-profile quad flat package outline
1. Drawing is not to scale.
Stencil Thickness Between 100 µm to 125 µm
Pad trace width 100 µm
Ball Diameter 320 µm
Table 70. WLCSP64 recommended PCB design rules (0.5 mm pitch) (continued)
Dimension Recommended values
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