Datasheet

DS5792 Rev 13 121/143
STM32F103xC, STM32F103xD, STM32F103xE Package information
135
Figure 69. WLCSP64 - 64-ball, 4.4757 x 4.4049 mm, 0.5 mm pitch wafer level chip scale
package recommended footprint
b
(2)
0.290 0.320 0.350 0.0114 0.0126 0.0138
e - 0.500 - - 0.0197 -
e1 - 3.500 - - 0.1378 -
F - 0.447 - - 0.0176 -
G - 0.483 - - 0.0190 -
D 4.446 4.466 4.486 0.1750 0.1758 0.1766
E 4.375 4.395 4.415 0.1722 0.1730 0.1738
H - 0.250 - - 0.0098 -
L - 0.200 - - 0.0079 -
eee - 0.05 - - 0.0020 -
aaa - 0.10 - - 0.0039 -
Number of balls 64
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum ball diameter parallel to primary datum Z.
Table 70. WLCSP64 recommended PCB design rules (0.5 mm pitch)
Dimension Recommended values
Pitch 0.5
Dpad 250 µm
Dsm 300 µm
Stencil Opening 320 µm
Table 69. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
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'SDG
'VP