Datasheet

Package information STM32F103xC, STM32F103xD, STM32F103xE
120/143 DS5792 Rev 13
6.3 WLCSP64 package information
Figure 68. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package outline
1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the ball.
Table 69. WLCSP, 64-ball 4.466 × 4.395 mm, 0.500 mm pitch, wafer-level chip-scale
package mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.535 0.585 0.635 0.0211 0.0230 0.0250
A1 0.205 0.230 0.255 0.0081 0.0091 0.0100
A2 0.330 0.355 0.380 0.0130 0.0140 0.0150
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