Datasheet

Package information STM32F103xC, STM32F103xD, STM32F103xE
118/143 DS5792 Rev 13
Figure 66. LFBGA100 – 100-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package recommended footprintoutline
eee - - 0.150 - - 0.0059
fff - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 68. LFBGA100 recommended PCB design rules (0.8 mm pitch BGA)
Dimension Recommended values
Pitch 0.8
Dpad 0.500 mm
Dsm
0.570 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening 0.500 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.120 mm
Table 67. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package
mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
+B)3B9
'SDG
'VP