Datasheet
Package information STM32F103xC, STM32F103xD, STM32F103xE
116/143 DS5792 Rev 13
Device marking for LFBGA144 package
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
Figure 64. LFBGA144 marking example (package top view)
1. Parts marked as ES or E or accompanied by an Engineering Sample notification letter are not yet qualified
and therefore not approved for use in production. ST is not responsible for any consequences resulting
from such use. In no event will ST be liable for the customer using any of these engineering samples in
production. ST’s Quality department must be contacted prior to any decision to use these engineering
samples to run a qualification activity
UBM 0.350 mm
Dsm
0.470 mm typ. (depends on the solder mask
registration tolerance)
Stencil opening 0.400 mm
Stencil thickness Between 0.100 mm to 0.125 mm
Pad trace width 0.120 mm
Ball Diameter 0.400 mm
Table 66. LFBGA144 recommended PCB design rules (0.8 mm pitch BGA) (continued)
Dimension Recommended values
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