Datasheet

DS5792 Rev 13 115/143
STM32F103xC, STM32F103xD, STM32F103xE Package information
135
Figure 63. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package recommended footprint
b 0.350 0.400 0.450 0.0138 0.0157 0.0177
D 9.900 10.000 10.100 0.3898 0.3937 0.3976
D1 - 8.800 - - 0.3465 -
E 9.900 10.000 10.100 0.3898 0.3937 0.3976
E1 - 8.800 - - 0.3465 -
e - 0.800 - - 0.0315 -
F - 0.600 - - 0.0236 -
ddd - - 0.100 - - 0.0039
eee - - 0.150 - - 0.0059
fff - - 0.080 - - 0.0031
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. STATSChipPAC package dimensions.
Table 66. LFBGA144 recommended PCB design rules (0.8 mm pitch BGA)
Dimension Recommended values
Pitch 0.8 mm
Dpad 0.400 mm
Table 65. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Typ Min Max
/)%*$B;B)3B9
'SDG
'VP