Datasheet

Package information STM32F103xC, STM32F103xD, STM32F103xE
114/143 DS5792 Rev 13
6 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
6.1 LFBGA144 package information
Figure 62. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package outline
1. Drawing is not to scale.
Table 65. LFBGA144 – 144-ball low profile fine pitch ball grid array, 10 x 10 mm,
0.8 mm pitch, package mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Typ Min Max
A
(2)
- - 1.700 - - 0.0669
A1 0.250 0.300 0.350 0.098 0.0118 0.0138
A2 0.810 0.910 1.010 0.0319 0.0358 0.0398
A3 0.225 0.26 0.295 0.0089 0.0102 0.0116
A4 0.585 0.650 0.715 0.0230 0.0256 0.0281
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