Datasheet

Package characteristics STM32F103xC, STM32F103xD, STM32F103xE
112/136 DocID14611 Rev 10
6 Package characteristics
6.1 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 62.BGA pad footprint
Table 65.Recommended PCB design rules (0.80/0.75 mm pitch BGA)
Dimension Recommended values
Dpad ∅
= 0.37 mm
Dsm ∅ = 0.52 mm typ. (depends on solder mask registration tolerance)
Solder paste 0.37 mm aperture diameter
– Non solder mask defined pads are recommended
– 4 to 6 mils screen print
$PAD
$SM
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