Datasheet

Package characteristics STM32F103x8, STM32F103xB
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Figure 35. LFBGA100 - low profile fine pitch ball grid array package outline
1. Drawing is not to scale.
Table 50. LFBGA100 - low profile fine pitch ball grid array package mechanical data
Dim.
mm inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Min Typ Max Min Typ Max
A 1.700 0.0669
A1 0.270 0.0106
A2 1.085 0.0427
A3 0.30 0.0118
A4 0.80 0.0315
b 0.45 0.50 0.55 0.0177 0.0197 0.0217
D 9.85 10.00 10.15 0.3878 0.3937 0.3996
D1 7.20 0.2835
E 9.85 10.00 10.15 0.3878 0.3937 0.3996
E1 7.20 0.2835
e 0.80 0.0315
F 1.40 0.0551
ddd 0.12 0.0047
eee 0.15 0.0059
fff 0.08 0.0031
N (number of balls) 100
ai14396
A2 A4 A3 A1 A
Seating plane
B
A1 corner index area
(see note 5)
(100 balls)
Bottom view
12345678910
F
E1
E
e
A
D
D1
e
F
K
J
H
G
F
E
D
C
B
A
ddd
C
C
eee
fff
CA
B
CM
M
∅
∅
b
∅