Datasheet

Package information STM32F103x4, STM32F103x6
86/99 DocID15060 Rev 7
Figure 48. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball
grid array, recommended footprint
e - 0.500 - - 0.0197 -
F - 0.750 - - 0.0295 -
ddd - - 0.080 - - 0.0031
eee - - 0.150 - - 0.0059
fff - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 55. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA)
Dimension Recommended values
Pitch 0.5
Dpad 0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening 0.280 mm
Stencil thickness Between 0.100 mm and 1.125 mm
Pad trace width 0.100 mm
Table 54. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball
grid array package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
5B)3B9
'SDG
'VP