Datasheet

Package characteristics STM32F100xC, STM32F100xD, STM32F100xE
90/105 DocID15081 Rev 8
6 Package characteristics
6.1 Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Figure 38. LQFP144 - 144-pin, 20 x 20 mm low-profile quad flat
package outline
1. Drawing is not to scale.
E
)$%.4)&)#!4)/.
0).
'!5'%0,!.%
MM
3%!4).'
0,!.%
$
$
$
%
%
%
+
CCC
#
#








!?-%?6
!
!
!
,
,
C
B
!