Datasheet

DocID16455 Rev 8 83/95
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB Package characteristics
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Figure 44. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball
grid array, recommended footprint
E1 - 3.500 - - 0.1378 -
e - 0.500 - - 0.0197 -
F - 0.750 - - 0.0295 -
ddd - - 0.080 - - 0.0031
eee - - 0.150 - - 0.0059
fff - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 51. TFBGA64 recommended PCB design rules (0.5 mm pitch BGA)
Dimension Recommended values
Pitch 0.5
Dpad 0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening 0.280 mm
Stencil thickness Between 0.100 mm and 1.125 mm
Pad trace width 0.100 mm
Table 50. TFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch, thin profile fine pitch ball
grid array package mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
5B)3B9
'SDG
'VP