Datasheet

Electrical characteristics STM32F091xB STM32F091xC
54/128 DocID026284 Rev 4
6.3 Operating conditions
6.3.1 General operating conditions
6.3.2 Operating conditions at power-up / power-down
The parameters given in Table 25 are derived from tests performed under the ambient
temperature condition summarized in Table 24.
Table 24. General operating conditions
Symbol Parameter Conditions Min Max Unit
f
HCLK
Internal AHB clock frequency - 0 48
MHz
f
PCLK
Internal APB clock frequency - 0 48
V
DD
Standard operating voltage - 2.0 3.6 V
V
DDIO2
I/O supply voltage
Must not be supplied if V
DD
is not present
1.65 3.6 V
V
DDA
Analog operating voltage
(ADC and DAC not used)
Must have a potential equal
to or higher than V
DD
V
DD
3.6
V
Analog operating voltage
(ADC and DAC used)
2.4 3.6
V
BAT
Backup operating voltage - 1.65 3.6 V
V
IN
I/O input voltage
TC and RST I/O -0.3 V
DDIOx
+0.3
VTTa I/O -0.3 V
DDA
+0.3
(1)
FT and FTf I/O -0.3 5.5
(1)
P
D
Power dissipation at T
A
= 85 °C
for suffix 6 or T
A
= 105 °C for
suffix 7
(2)
UFBGA100 - 364
mW
LQFP100 - 476
LQFP64 - 455
WLCSP64 - 377
UFBGA64 - 308
LQFP48 - 370
UFQFPN48 - 625
T
A
Ambient temperature for the
suffix 6 version
Maximum power dissipation –40 85
°C
Low power dissipation
(3)
–40 105
Ambient temperature for the
suffix 7 version
Maximum power dissipation –40 105
°C
Low power dissipation
(3)
–40 125
T
J Junction temperature range
Suffix 6 version –40 105
°C
Suffix 7 version –40 125
1. For operation with a voltage higher than V
DDIOx
+ 0.3 V, the internal pull-up resistor must be disabled.
2. If T
A
is lower, higher P
D
values are allowed as long as T
J
does not exceed T
Jmax
. See Section 7.8: Thermal characteristics
3. In low power dissipation state, T
A
can be extended to this range as long as T
J
does not exceed T
Jmax
(see Section 7.8:
Thermal characteristics).
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