Datasheet

Package information STM32F091xB STM32F091xC
110/128 DocID026284 Rev 4
Figure 43. Recommended footprint for WLCSP64 package
b
(2)
0.220 0.250 0.280 0.0087 0.0098 0.0110
D 3.312 3.347 3.382 0.1304 0.1318 0.1331
E 3.550 3.585 3.620 0.1398 0.1411 0.1425
e - 0.400 - - 0.0157 -
e1 - 2.800 - - 0.1102 -
e2 - 2.800 - - 0.1102 -
F - 0.2735 - - 0.0108 -
G - 0.3925 - - 0.0155 -
aaa - - 0.100 - - 0.0039
bbb - - 0.100 - - 0.0039
ccc - - 0.100 - - 0.0039
ddd - - 0.050 - - 0.0020
eee - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 76. WLCSP64 recommended PCB design rules
Dimension Recommended values
Pitch 0.4
Dpad
260 µm max. (circular)
220 µm recommended
Dsm 300 µm min. (for 260 µm diameter pad)
PCB pad design Non-solder mask defined via underbump allowed.
Table 75. WLCSP64 package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
069
'VP
'SDG
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