Datasheet

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STM32F091xB STM32F091xC Package information
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Figure 40. Recommended footprint for UFBGA64 package
ddd - - 0.080 - - 0.0031
eee - - 0.150 - - 0.0059
fff - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 74. UFBGA64 recommended PCB design rules
Dimension Recommended values
Pitch 0.5
Dpad 0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening 0.280 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.100 mm
Table 73. UFBGA64 package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.460 0.530 0.600 0.0181 0.0209 0.0236
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