Datasheet

DocID025004 Rev 5 107/128
STM32F072x8 STM32F072xB Package information
124
Figure 42. Recommended footprint for UFBGA64 package
ddd - - 0.080 - - 0.0031
eee - - 0.150 - - 0.0059
fff - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 75. UFBGA64 recommended PCB design rules
Dimension Recommended values
Pitch 0.5
Dpad 0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening 0.280 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.100 mm
Table 74. UFBGA64 package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.460 0.530 0.600 0.0181 0.0209 0.0236
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