Datasheet

Package information STM32F051x4 STM32F051x6 STM32F051x8
92/121 DocID022265 Rev 6
Figure 35. Recommended footprint for UFBGA64 package
Device marking
The following figure gives an example of topside marking orientation versus ball A1 identifier
location.
b 0.170 0.280 0.330 0.0067 0.0110 0.0130
D 4.850 5.000 5.150 0.1909 0.1969 0.2028
D1 3.450 3.500 3.550 0.1358 0.1378 0.1398
E 4.850 5.000 5.150 0.1909 0.1969 0.2028
E1 3.450 3.500 3.550 0.1358 0.1378 0.1398
e - 0.500 - - 0.0197 -
F 0.700 0.750 0.800 0.0276 0.0295 0.0315
ddd - - 0.080 - - 0.0031
eee - - 0.150 - - 0.0059
fff - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 66. UFBGA64 recommended PCB design rules
Dimension Recommended values
Pitch 0.5
Dpad 0.280 mm
Dsm
0.370 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening 0.280 mm
Stencil thickness Between 0.100 mm and 0.125 mm
Pad trace width 0.100 mm
Table 65. UFBGA64 package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.460 0.530 0.600 0.0181 0.0209 0.0236
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