Datasheet

DocID022265 Rev 6 109/121
STM32F051x4 STM32F051x6 STM32F051x8 Package information
115
Figure 52. UFQFPN32 package outline
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device
ground and must be connected. It is referred to as pin 0 in Table: Pin definitions.
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