Datasheet

Package information STM32F051x4 STM32F051x6 STM32F051x8
104/121 DocID022265 Rev 6
Figure 47. Recommended pad footprint for WLCSP36 package
F - 0.3025 - - 0.0119 -
G - 0.3515 - - 0.0138 -
aaa - - 0.100 - - 0.0039
bbb - - 0.100 - - 0.0039
ccc - - 0.100 - - 0.0039
ddd - - 0.050 - - 0.0020
eee - - 0.050 - - 0.0020
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
Table 71. WLCSP36 recommended PCB design rules
Dimension Recommended values
Pitch 0.4 mm
Dpad
260 µm max. (circular)
220 µm recommended
Dsm 300 µm min. (for 260 µm diameter pad)
PCB pad design Non-solder mask defined via underbump allowed
Table 70. WLCSP36 package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
069
'VP
'SDG
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