Datasheet
Package information STM32F031x4 STM32F031x6
94/106 DocID025743 Rev 6
Figure 44. Recommended footprint for WLCSP25 package
aaa - 0.100 - - 0.0039 -
bbb - 0.100 - - 0.0039 -
ccc - 0.100 - - 0.0039 -
ddd - 0.050 - - 0.0020 -
eee - 0.050 - - 0.0020 -
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Back side coating.
3. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
4. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
Table 66. WLCSP25 recommended PCB design rules
Dimension Recommended values
Pitch 0.4 mm
Dpad 0.225 mm
Dsm
0.290 mm typ. (depends on the soldermask
registration tolerance)
Stencil opening 0.250 mm
Stencil thickness 0.100 mm
Table 65. WLCSP25 package mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
:/&63B$1B)3B9
'SDG
'VP
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