Datasheet

Maximum ratings STLM20
8/19 Doc ID 12495 Rev 13
3 Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 5. Absolute maximum ratings
Symbol Parameter Value Unit
T
STG
Storage temperature –65 to +150 °C
T
SLD
(1)
1. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Lead solder temperature for 10 seconds 260 °C
V
O
Output voltage –0.3 to V
CC
+ 0.3 V
V
CC
Supply voltage –0.2 to 6.5 V
I
O
Output current 10 mA
T
J(max)
Maximum junction temperature 150 °C
θ
JA
Thermal resistance
SOT323-5L 331.4 °C/W
UDFN-4L 160.2 °C/W
T
A
(2)
2. Grade 7: STLM20W87F
Grade 9: STLM20DD9F
Ambient operating temperature
Grade 7 –55 to 130 °C
Grade 9 –40 to 85 °C