Datasheet

STD20NF06L
2/11
Table 4: THERMAL DATA
(*)
When Mounted on 1 inch
2
FR-4 board, 2 oz of Cu
ELECTRICAL CHARACTERISTICS (T
CASE
= 25 °C UNLESS OTHERWISE SPECIFIED)
Table 5: OFF
Table 6: ON
(*)
Table 7: DYNAMIC
Rthj-case
Rthj-pcb
T
l
Thermal Resistance Junction-case
(*)
Thermal Resistance Junction-PCB
Maximum Lead Temperature For Soldering Purpose
(1.6 mm from case, for 10 sec)
Max
Max
2.5
50
275
°C/W
°C/W
°C
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
D
= 250 µA, V
GS
= 0
60 V
I
DSS
Zero Gate Voltage
Drain Current (V
GS
= 0)
V
DS
= Max Rating
V
DS
= Max Rating T
C
= 125°C
1
10
µA
µA
I
GSS
Gate-body Leakage
Current (V
DS
= 0)
V
GS
= ± 18 V
±100 nA
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
Gate Threshold Voltage
V
DS
= V
GS
I
D
= 250 µA
1V
R
DS(on)
Static Drain-source On
Resistance
V
GS
= 10 V I
D
= 12 A
V
GS
= 5 V I
D
= 12 A
0.032 0.040
0.050
Ω
Ω
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
fs
(*)
Forward Transconductance
V
DS
= 25 V I
D
= 12 A
20 S
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V
DS
= 25V f = 1 MHz V
GS
= 0
660
170
70
pF
pF
pF