Datasheet

ST7LITE0xY0, ST7LITESxY0
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14.2 THERMAL CHARACTERISTICS
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
D
= (T
J
-T
A
) / R
thJA
.
The power dissipation of an application can be defined by the user with the formula: P
D
=P
INT
+P
PORT
where P
INT
is the chip internal power (I
DD
xV
DD
) and P
PORT
is the port power dissipation depending on the
ports used in the application.
Symbol Ratings Value Unit
R
thJA
Package thermal resistance SO16
(junction to ambient) DIP16
95
TBD
°C/W
T
Jmax
Maximum junction temperature
1)
150 °C
P
Dmax
Power dissipation
2)
500 mW