Datasheet

5.3 Reflow soldering
The SPBTLE-1S is a high temperature strength surface mount Bluetooth® module supplied on a 23 pin, 4-layer
PCB.
Module is assembled with special soldering paste that allow to make the additional reflow with no changes in the
module original characteristic. It’s important to respect the parameter listed in the follow table.
The final assembly recommended reflow profiles are indicated here below.
Soldering phase has to be executed with care: in order to avoid undesired melting phenomenon, particular
attention has to be taken on the set up of the peak temperature. Here following some suggestions for the
temperature profile based on following recommendations.
Table 8. Soldering
Profile feature Pb-free assembly
Average ramp up rate (T
SMAX
to T
p
)
3 °C / s max.
Preheat
Temperature min. (T
S
min.)
150 °C
Temperature max. (T
S
max.)
200 °C
Time (t
S
min. to t
S
max.) (t
S
))
60 - 100 s
Time maintained above
Temperature T
L
217 °C
Time t
L
60 - 70 s
Peak temperature (T
P
)
245 (-0) °C
Time within 5 °C of peak temperature (T
P
-5 °C)
min. 30 s
Ramp down rate 6 °C / s
Time from 25 °C to peak temperature 8 minutes max.
Figure 9. Soldering profiles
SPBTLE-1S
Reflow soldering
DS12065 - Rev 5
page 12/25