Datasheet

2.2 Reflow profile
Figure 25. ST ECOPACK
®
recommended soldering reflow profile for PCB mounting
250
0
50
100
150
200
240210180150120906030 300270
-6 °C/s
240-245 °C
2 - 3 °C/s
Temperature (°C)
-2 °C/s
-3 °C/s
Time (s)
0.9 °C/s
60 sec
(90 max)
Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile
corresponds to the latest IPC/JEDEC J-STD-020.
SM6TY
Reflow profile
DS6905 - Rev 10
page 10/15