Datasheet

MPG/SR/2003004
4/5
APPENDIX A. PRODUCT / PROCESS CHANGE NOTIFICATION
✁
Corporate Quality Procedure SOP271Rev. G
Ref: MPG/SR/2003004
Sales Type / Product Family: See attached list.
Customer: All those using any of the devices listed.
Type of Change: New Lead-free package
Reason for Change: To make the devices more environmentally friendly
Description of Change: New Lead-free package
Forecasted Date of Change: April 1, 2004
Availability Date of Samples for Customer: October 1, 2003
Forecasted Date for Internal STMicroelectronics
Change Qualification Report Availability:
Now
Marking to Identify Changed Product, e.g. Date
Code Change:
See attached.
Description of the Qualification Program: According to ST Corporate Procedure
Product Line(s) and/or Part Number(s): See attached list.
Manufacturing Location(s): Wafer Fabrication: Carrollton, USA
Assembly Location: Muar, Malaysia
Test Location: Muar, Malaysia
Forecasted Date of Shipment: April 1, 2004
Division Product Management:
R. SONNINO
Group Q. A. Manager:
A. PANCHIERI
Date: October 2nd, 2003
Customer Acknowledgment of Receipt Ref: MPG/SR/2003004
Please sign and return to STMicroelectronics Sales Office
❑ Qualification Plan Denied Name:
❑ Qualification Plan Approved Title:
Company:
❑ Change Denied Date:
❑ Change Approved Signature: