Datasheet

Revision history M24M01-R M24M01-DF
46/47 DocID12943 Rev 14
13-May-2015 11
Added:
– Unsawn wafer reference on cover page and Table 21: Ordering
information scheme (unsawn wafer)
– Figure 3
– Notes 1 and 2 on Table 5
– title of Table 10
– note 1 on Ta ble 11
–V
IL
parameter on Table 12 and Table 13
–t
NS
max value on Table 14 and Table 15
– note 9 on Table 13
– Table 20
Added:
– Notes 9 and 10 on Table 12
– Notes 2and 3 on Table 13
– Figure 19: WLCSP 8-bump wafer-length chip-scale package
recommended land pattern
– Table 21
– Engineering samples reference
Removed:
– note 5 on Min value of t
CLQX
Table 13
10-June-2015 12
Updated:
– Note 1 on Figure 2
– Table 20
– note 1 on Table 20
04-Jul-2016 13
Updated:
– Table 12: DC characteristics (M24M01-R, device grade 6),
Table 13: DC characteristics (M24M01-DF, device grade 6),
Table 18: WLCSP- 8-bump, without BSC, 2.578 x 1.716 mm, wafer
level chip scale package outline, Figure 18: WLCSP- 8-bump,
without BSC, 2.578 x 1.716 mm, wafer level chip scale package
outline, Figure 20: WLCSP- 8-bump, 2.578 x 1.716 mm, wafer level
chip scale package recommended footprint
Added:
– Table 19: WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer
level chip scale package outline, Figure 19: WLCSP- 8-bump, with
BSC, 2.578 x 1.716 mm, wafer level chip scale package outline
23-Oct-2017 14
Added CX reference in WLCSP package in cover page, Section 9.3:
WLCSP8 ultra thin package information.
Updated title in Figure 3: WLCSP connections (top view, marking
side, with balls on the underside), Table 5: Absolute maximum
ratings, Table 21: Ordering information scheme
Table 23. Document revision history (continued)
Date Revision Changes