Datasheet

Package information M24M01-R M24M01-DF
40/47 DocID12943 Rev 14
Figure 21. WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale
package outline
1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
Table 20. WLCSP- 8-bump, with BSC, 2.578 x 1.716 mm, wafer level chip scale
package outline
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.525 0.565 0.605 0.0207 0.0222 0.0238
A1 - 0.190 - - 0.0075 -
A2 - 0.350 - - 0.0138 -
A3 - 0.025 - - 0.0010 -
b
(2)
- 0.270 - - 0.0106 -
D - 2.578 2.598 - 0.1015 0.1023
E - 1.716 1.736 - 0.0676 0.0683
e - 1.000 - - 0.0394 -
e1 - 0.866 - - 0.0341 -
e2 - 0.500 - - 0.0197 -
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