Datasheet

DocID12943 Rev 14 39/47

M24M01-R M24M01-DF Package information

e2 - 0.500 - - 0.0197 -

e3 - 0.500 - - 0.0197 -

F - 0.425 - - 0.0167 -

G - 0.789 - - 0.0311 -

aaa - 0.110 - - 0.0043 -

bbb - 0.110 - - 0.0043 -

ccc - 0.110 - - 0.0043 -

ddd - 0.060 - - 0.0024 -

eee - 0.060 - - 0.0024 -

1. Values in inches are converted from mm and rounded to 4 decimal digits.

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

Table 19. WLCSP- 8-bump, without BSC, 2.578 x 1.716 mm, wafer level chip scale

package outline (continued)

Symbol

millimeters inches

(1)

Min Typ Max Min Typ Max