Datasheet

Package information M24M01-R M24M01-DF
38/47 DocID12943 Rev 14
9.4 WLCSP8 package information
Figure 20. WLCSP- 8-bump, without BSC, 2.578 x 1.716 mm, wafer level chip scale
package outline
1. Drawing is not to scale.
2. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
Table 19. WLCSP- 8-bump, without BSC, 2.578 x 1.716 mm, wafer level chip scale
package outline
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.500 0.540 0.580 0.0197 0.0213 0.0228
A1 - 0.190 - - 0.0075 -
A2 - 0.350 - - 0.0138 -
b
(2)
- 0.270 - - 0.0106 -
D - 2.578 2.598 - 0.1015 0.1023
E - 1.716 1.736 - 0.0676 0.0683
e - 1.000 - - 0.0394 -
e1 - 0.866 - - 0.0341 -
7239,(: %277209,(:6,'(9,(:
;
<
DDD
EEE =
;
HHH
]
FFF
GGG
=
=
0
0
<;
E;



=
%803
3,1
&251(5
'(7$,/$
'(7$,/$
527$7('
6($7,1*3/$1(
$
)
*
*
H

H
H

H

H
)
(B:/&635B0BQR%6&B0(B9
$
$
(
'