Datasheet
DocID12943 Rev 14 37/47
M24M01-R M24M01-DF Package information
46
Figure 19. WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale
recommended footprint
1. Dimensions are expressed in millimeters.
G - 0.789 - - 0.0311 -
aaa - 0.11 - - 0.0043 -
bbb - 0.11 - - 0.0043 -
ccc - 0.11 - - 0.0043 -
ddd - 0.06 - - 0.0024 -
eee - 0.06 - - 0.0024 -
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Table 18. WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale
mechanical data (continued)
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
%5B:/&63B)3B9