Datasheet

Package information M24M01-R M24M01-DF
36/47 DocID12943 Rev 14
9.3 WLCSP8 ultra thin package information
Figure 18. WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale
package outline
1. Drawing is not to scale.
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
3. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
4. Bump position designation per JESD 95-1, SPP-010.
Table 18. WLCSP - 8 balls, 2.578x1.716 mm, 0.5 mm pitch, wafer level chip scale
mechanical data
Symbol
millimeters inches
(1)
Min Typ Max Min Typ Max
A 0.425 0.465 0.505 0.0167 0.0183 0.0199
A1 - 0.190 - - 0.0075 -
A2 - 0.275 - - 0.0108 -
b - 0.270 - - 0.0106 -
D - 2.578 2.598 - 0.1015 0.1023
E - 1.716 1.736 - 0.0676 0.0683
e - 1.000 - - 0.0394 -
e1 - 0.866 - - 0.0341 -
e2 - 0.500 - - 0.0197 -
e3 - 0.500 - - 0.0197 -
F - 0.425 - - 0.0167 -
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