Datasheet

Package information M24M01-R M24M01-DF

32/47 DocID12943 Rev 14

9 Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK

packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK

is an ST trademark.

For die information concerning the M24M01 delivered in unsawn wafer, please contact your

nearest ST Sales Office.

9.1 TSSOP8 package information

Figure 15.TSSOP8 – 3x4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package outline

1. Drawing is not to scale.

Table 16. TSSOP8 – 3 x 4.4 mm, 0.65 mm pitch, 8-lead thin shrink small outline,

package mechanical data

Symbol

millimeters inches

(1)

Min. Typ. Max. Min. Typ. Max.

A - - 1.200 - - 0.0472

A1 0.050 - 0.150 0.0020 - 0.0059

A2 0.800 1.000 1.050 0.0315 0.0394 0.0413

b 0.190 - 0.300 0.0075 - 0.0118

c 0.090 - 0.200 0.0035 - 0.0079

CP - - 0.100 - - 0.0039

D 2.900 3.000 3.100 0.1142 0.1181 0.1220

e - 0.650 - - 0.0256 -

76623$0B9

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