Datasheet

Package mechanical data M24C64-DF, M24C64-W, M24C64-R, M24C64-F
36/43 Doc ID 16891 Rev 21
Figure 19. WLCSP-R 5-bump wafer-length chip-scale package outline
1. Drawing is not to scale.
Table 22. WLCSP-R 5-bump wafer-length chip-scale package mechanical data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.545 0.455 0.635 0.0215 0.0179 0.0250
A1 0.190 0.0075
A2 0.355 0.0140
b
(2)
2. Dimension measured at the maximum bump diameter parallel to primary datum Z.
0.270 0.0106
D 0.959 1.074 0.0378 0.0423
E 1.073 1.168 0.0422 0.0460
e 0.693 0.0273
e1 0.400 0.0157
e2 0.3465 0.0136
F 0.280 0.0110
G 0.190 0.0075
N (number of terminals) 5 5
aaa 0.110 0.0043
eee 0.060 0.0024
"UMP
$ETAIL!
ROTATEDBY
7AFERBACKSIDE
3IDEVIEW
/RIENTATIONREFERENCE
/RIENTATIONREFERENCE
$ETAIL!
"UMPSIDE
!
!
E
E
E
#
"
!


'
&
!
$
%
B
-3