Datasheet

M24C64-DF, M24C64-W, M24C64-R, M24C64-F Package mechanical data
Doc ID 16891 Rev 21 35/43
Figure 18. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
2 × 3mm, package outline
1. Drawing is not to scale.
2. The central pad (E2 × D2 area in the above illustration) is internally pulled to V
SS
. It must not be allowed to
be connected to any other voltage or signal line on the PCB, for example during the soldering process.
3. The circle in the top view of the package indicates the position of pin 1.
Table 21. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to 4 decimal digits.
Typ Min Max Typ Min Max
A 0.550 0.450 0.600 0.0217 0.0177 0.0236
A1 0.020 0 0.050 0.0008 0 0.0020
b 0.250 0.200 0.300 0.0098 0.0079 0.0118
D 2.000 1.900 2.100 0.0787 0.0748 0.0827
D2 (rev MB) 1.600 1.500 1.700 0.0630 0.0591 0.0669
D2 (rev MC) 1.200 1.600 0.0472 0.0630
E 3.000 2.900 3.100 0.1181 0.1142 0.1220
E2 (rev MB) 0.200 0.100 0.300 0.0079 0.0039 0.0118
E2 (rev MC) 1.20 1.6 0.0472 0.0630
e 0.500 - - 0.0197 - -
K - 0.300 - - 0.0118 -
L - 0.300 0.500 - 0.0118 0.0197
L1 - - 0.150 - 0.0059
L3 0.300 - - 0.0118 -
ddd
(2)
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
0.050 - - 0.0020 - -
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