Datasheet

M24C32-W M24C32-R M24C32-F Package mechanical data

Doc ID 4578 Rev 17 31/38

Figure 16. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package outline

1. Drawing is not to scale.

2. The central pad (the E2 × D2 area in the above illustration) is internally pulled to V

. It should not be

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 20. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead

2 × 3mm, package mechanical data

Symbol

millimeters inches

(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Typ Min Max Typ Min Max

A 0.55 0.50 0.60 0.0217 0.0197 0.0236

A1 0.02 0.00 0.05 0.0008 0 0.0020

b 0.25 0.20 0.30 0.0098 0.0079 0.0118

D 2.00 1.90 2.10 0.0787 0.0748 0.0827

D2 1.60 1.50 1.70 0.0630 0.0591 0.0669

ddd 0.08 0.0031

E 3.00 2.90 3.10 0.1181 0.1142 0.1220

E2 0.20 0.10 0.30 0.0079 0.0039 0.0118

e0.50– –0.0197– –

L 0.45 0.40 0.50 0.0177 0.0157 0.0197

L1 0.15 0.0059

L3 0.30 0.0118

UFDFPN-01

ddd