Datasheet

12/15
MOUNTING INSTRUCTION
The Rth-j-amb of the L4962 can be reduced by
solderingthe GND pinsto a suitable copper area of
the printed circuit board (Fig. 32).
The diagram of figure 33 shows the R
th-j-amb
as a
function of the side ”l” of two equal square copper
areas having the thicknessof 35µ (1.4 mils). During
soldering the pins temperature must not exceed
260°C and the soldering time must not be longer
than 12 seconds.
The external heatsink or printed circuit copper are
must be connected to electrical ground.
Figure 32.ExampleofP.C. boardcopperareawhichis used
as heatsink
Figure 33. Maximum dissipable
power and junction to ambient
thermal resistance vs. side ”l”
L4962