Datasheet

ECMF02-2AMX6
Recommendation on PCB assembly
DocID17815 Rev 3
11/13
4.6 Reflow profile
Figure 27: ST ECOPACK
®
recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component
movement. Maximum soldering profile corresponds to the latest
IPC/JEDEC J-STD-020.